Light emitting module and head lamp including the same

ABSTRACT

Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of co-pending application Ser. No.13/368,140 filed on Feb. 7, 2012, which claims priority under 35 U.S.C.§119 from Korean Application No. 10-2011-0068481 filed in Korea on Jul.11, 2011, the subject matter of which is hereby incorporated in itsentirety by reference as if fully set forth herein.

TECHNICAL FILED

Embodiments may relate to a light emitting module and a head lampincluding the same.

BACKGROUND

Generally, a light emitting diode (LED) may one of semiconductor devicesthat convert an electric energy into light. The light emitting diode hasseveral advantages of low power consumption, semipermanent use, fastresponse speed, safety and environment-friendliness. Accordingly, therehave been many studies under progress to replace a conventional lightsource with the light emitting diode and the light emitting device hasbeen used as a light source of a lighting system such as a variety oflamps used indoor and outdoor, a liquid crystal display device, anelectronic display board, a streetlamp and the like.

Meanwhile, such the light emitting diode can be applied to a head lampfor a vehicle. In a conventional head lamp according to a prior art, awire and a light emitting device are exposed and there might be adisadvantage of degraded reliability of the head lamp.

SUMMARY

Accordingly, the embodiments may provide a light emitting module havingimproved reliability and a head lamp including the same.

In one embodiment, a light emitting module comprises a light emittingdevice package comprising a circuit board having a cavity, an insulationsubstrate disposed in the cavity, with a conductive pattern disposedthereon, and at least one light emitting device disposed on theinsulation substrate, with being electrically connected with theconductive pattern; and a glass cover disposed on the light emittingdevice package, with lateral surfaces, a top surface and an open bottomsurface, wherein the light emitting device package and the circuit boardare electrically connected with each other.

In another embodiment, a light emitting module comprises a circuitboard; at least one light emitting device disposed on the circuit board,with being electrically connected with the circuit board; and a glasscover disposed on the circuit board, spaced apart a predetermineddistance from a top surface of the light emitting device, the glasscover comprising lateral surfaces, a top surface and an open bottomsurface.

In another embodiment, a head lamp comprises a light emitting moduleconfigured to emit a light; a reflector configured to reflect the lightemitted from the light emitting module; and a lens configured to refractthe light emitted from the light emitting module and the light reflectedby the reflector, wherein the light emitting module comprises a circuitboard; at least one light emitting device disposed on the circuit board,with being electrically connected with the circuit board; and a glasscover disposed on the circuit board, spaced apart a predetermineddistance from a top surface of the light emitting device, the glasscover comprising lateral surfaces, a top surface and an open bottomsurface.

BRIEF DESCRIPTION OF THE DRAWINGS

Arrangements and embodiments may be described in detail with referenceto the following drawings in which like reference numerals refer to likeelements and wherein:

FIG. 1 is a diagram illustrating a light emitting module according to anembodiment;

FIGS. 2a and 2b are diagrams illustrating a glass cover according to anembodiment;

FIG. 3 is a diagram illustrating a glass supporting part according to anembodiment;

FIG. 4 is a diagram illustrating a light emitting module according toanother embodiment;

FIG. 5 is a diagram illustrating a glass cover according to anotherembodiment;

FIG. 6 is a diagram illustrating a glass cover according to a furtherembodiment;

FIG. 7 is a diagram illustrating a light emitting module according to afurther embodiment;

FIG. 8 is a diagram illustrating a light emitting module according to astill further embodiment;

FIG. 9 is a diagram illustrating a light emitting module according to astill further embodiment;

FIG. 10 a diagram illustrating a light emitting module according to astill further embodiment;

FIG. 11 a diagram illustrating a light emitting module according to astill further embodiment;

FIG. 12 is a diagram illustrating a head lamp having the light emittingmodule applied thereto according to an embodiment; and

FIG. 13 is a diagram illustrating an effect of the light emitting moduleaccording to the embodiments.

DETAILED DESCRIPTION

It will be understood that when an element is referred to as being ‘on’or “under” another element, it can be directly on/under the element, andone or more intervening elements may also be present. When an element isreferred to as being ‘on’ or ‘under’, ‘under the element’ as well as ‘onthe element’ can be included based on the element.

The thickness and size of each layer may be exaggerated, emitted orillustrated schematically in the drawings, for explanation andprecision. The size of each component shown in the drawings may notreflect the actual size completely.

As follows, a light emitting module according to embodiments will bedescribed in reference to the accompanying drawings.

FIG. 1 illustrates a light emitting module according to an embodiment.

In these embodiments or other embodiments, the light emitting device maybe semiconductor light emitting device, for example, light emittingdiode.

In reference to FIG. 1, the light emitting module according to theembodiment may include a light emitting device package having a metalsubstrate 101 having a cavity, an insulative substrate 102 located inthe cavity and at least one light emitting device 104 disposed on theinsulation substrate 102, a pad 110 electrically connected with thelight emitting device package via a wire 105, and a glass cover 107located over the light emitting device 104 to transmit the lightgenerated from the light emitting device 104.

A circuit pattern (not shown) and an insulation layer 111 may be locatedon the metal substrate 101. The metal substrate 101, the insulationlayer 111 and the circuit pattern may consist of a circuit board 120.

The metal substrate 101 may be a heat sink plate with high thermalconductivity and it may be formed of alloy of copper, aluminum, silveror gold, with the cavity.

The cavity of the metal substrate 101 may be a mounting part configuredto mount the light emitting device package and it may have a broaderarea than the light emitting device package. The mounting part to mountthe package may formed by exposing a surface of the metal substrateafter eliminate the insulation layer and the circuit pattern formed onthe metal substrate 101.

A thickness of the metal substrate 101 may be at least 0.5 mm. Thecavity of the metal substrate 101 has a depth of approximately 100˜500um and accounts for about 10˜70% of a total area of the metal substrate101.

The insulation layer 111 may act as an adhesive layer for a metalsubstrate 101, a circuit pattern (not shown), a pad 110 connected withthe circuit pattern to provide currents to a light emitting device 104and a supporting part 106, and be formed of epoxy-based orpolyamide-based resin, oxide or nitride.

The circuit pattern may be formed on the insulation layer 111 and also asolder resistor layer may be formed on the insulation layer 111.

The pad 110 may be electrically connected with the light emitting devicepackage via the wire 105. Alloy of nickel, silver, gold or palladium maybe surface-treated to a surface of the pad 110.

The light emitting device package may include an insulation substrate102, a conductive pattern 103 located on the insulation substrate 102and a plurality of light emitting devices 104 disposed on the conductivepattern 103.

The insulation substrate 102 may be formed of nitride having highthermal conductivity and it may be adhered to the metal substrate 101 tosecure heat radiation.

A thickness of the insulation substrate 102 may be in a range of 100 umto 1 mm.

The light emitting device 104 may have a light emitting structure havinga first conductive type semiconductor layer, an active layer and asecond conductive type semiconductor layer, a first electrode disposedon the first conductive type semiconductor layer and a second electrodedisposed on the second conductive type semiconductor layer.

The plurality of the light emitting devices 104 may be aligned in thelight emitting device package and they may be connected in serial or inparallel.

The light emitting device 104 or the conductive pattern 103 may beelectrically with each other via the pad 110 and the wire 105.

The conductive pattern 103 may have an electrode region where the lightemitting devices 104 are adhered and a connection region whereneighboring light emitting devices are wire-bonded.

The conductive pattern 103 may be formed as a thickness of 0.1˜300 um.And the pad 110 may be formed as a thickness of 0.1˜350 um.

The glass cover 107 is located over the light emitting device package toprotect the light emitting device 104.

The glass cover 107 may have lateral surfaces, a top surface and an openbottom surface. And a thickness of the glass cover 107 has no limit.

The glass cover 107 may be anti-reflective-coated, to transmit the lightgenerated from the light emitting device 104 efficiently, withoutreflecting the light.

For the anti-reflective coating, an anti-reflective coating film isattached to a glass base or an anti-reflective coating layer is formedby spin-coating or spray-coating anti-reflective coating liquid.

The anti-reflective coating layer may include at least one of TiO₂,SiO₂, Al₂O₃, Ta₂O₃, ZrO₂ or MgF₂.

According to another embodiment, the glass cover 107 may be located on asupporting part 106 located on the circuit board 120.

A distance (d) between the light emitting device 104 and the glass cover107 may be in a range of 0.2˜40 mm.

The glass cover 107 according to an embodiment may have a hole formed ina predetermined surface to exhaust gas generated by the heat of thelight emitting device 104 or the circuit board 120.

A predetermined one of the lateral surfaces of The glass cover 107 maybe open and the gas generated by the heat of the light emitting device104 or the circuit board 120 may be exhausted.

The glass cover may have a dome shape and a hole may be formed in thepredetermined surface of the glass cover. Accordingly, the gas generatedby the heat generated from the light emitting device 104 or the circuitboard 120 may be exhausted.

The glass cover 107 may include a color filter to transmit only a lightat a specific wavelength out of the lights generated from the lightemitting device 104.

According to embodiments, the glass cover 107 may have a predeterminedpattern and an orientation angle of the light generated from the lightemitting device 104 may be adjusted. In this instance, the type andshape of the pattern may not be limited to a specific one.

A phosphor layer may be formed on at least one surface of the glasscover 107 and the light generated from the light emitting device 104 maybe converted into a light at a specific wavelength.

When the phosphor layer is provided in the glass cover 107, phosphorparticles may convert the wavelength of the light generated from thelight emitting device 103 to output a light at a specific wavelength.

For example, when the light emitting device 104 outputs a blue light,the phosphor layer provided in the glass cover 107 may have a yellowphosphor to convert the output light into a white light.

The glass cover 107 may have a light extraction pattern formed in atleast one predetermined surface thereof and the light generated from thelight emitting device 104 may be reflected diffusively to improve thelight extraction efficiency of the light emitting module.

According to an embodiment, an inclined surface may be formed in atleast one of the lateral surfaces of the glass cover 107 and areflection layer may be formed on the inclined surface to reflect thelight generated from the light emitting device 104. The reflection layermay include at least one Al, Ag, Pt, Rh, Rd, Pd or Cr.

The inclined surface of the glass cover 107 may be tilted toward thecircuit board at approximately 10˜90 degrees.

According to an embodiment, the supporting part 106 may have areflection layer having at least one of Al, Ag, Pt, Rh, Rd, Pd or Cr toreflect the light generated from the light emitting device 104.

In this instance, the reflection layer may include a metal layer havinga reflective material, for example, Al, Ag, Pt, Rh, d, Pd, Cr or analloy of Al, Ag, Pt or Ph.

The light emitting module according to the embodiment may have the glasscover 107 and it may physically protect the wire 105 and the lightemitting device 104 provided in the light emitting device package.

For example, the light emitting module for a head lamp may be exposed toan external shock and heat, while moving at a rapid speed. Accordingly,the wire and other elements provided in the light emitting module may beexposed to physical danger factors. The light emitting module accordingto the embodiment may have the glass cover 107 and the wire and thelight emitting device may be protected physically.

Also, the light module may include the glass cover 107 having ananti-reflective coating layer, such that the inner elements of the lightemitting module may be protected and that the light generated from thelight emitting device 104 may be transmitted efficiently.

FIG. 2a is a diagram illustrating a glass cover according to anembodiment.

In reference to FIG. 2a , a glass cover 107 provided in the lightemitting module may include an anti-reflective coating layer 202. Ananti-reflective coating film may be attached to a glass material 201 oranti-reflective coating liquid may be spin-coated or spray-coated, toform the anti-reflective coating layer 202.

As a result, the light emitting module according to the embodiment mayminimize the light reflected inward within the glass cover 107 and thusit may have an effect in that the light generated from the lightemitting device 104 may be transmitted efficiently.

FIG. 2b is a diagram illustrating a glass cover according to anotherembodiment.

In reference to FIG. 2b , a glass cover 701 according to this embodimentmay include a predetermined surface where a light extraction pattern 107a is formed. Accordingly, the light generated from the light emittingdevice 104 may be reflected diffusively and light extraction efficiencyof the light emitting module may be improved.

FIG. 3 is a diagram illustrating a supporting part according to anembodiment.

In reference to FIG. 3, a supporting part 106 may be located on thecircuit board 120 and the glass cover 107 may be supported by thesupporting part 106.

A reflection layer 301 may be formed on a surface of the supporting part106 to reflect the light generated from the light emitting device 104.For example, the reflection layer 301 may be formed on a lateral surfaceof the supporting part 106 adjacent to the light emitting device 104.

The reflection layer 301 may include a metal layer formed of areflective material, for example, Al, Ag, Pt, Rh, Rd, Pd, Cr or an alloyof Al, Ag, Pt or Rh.

The reflection layer 301 of the supporting part 106 may reflect thelight generated from the light emitting device 104 to transmit the glasscover 107, such that the light extraction efficiency of the lightemitting module may be improved advantageously.

FIG. 4 is a diagram illustrating a light emitting module according toanother embodiment.

In reference to FIG. 4, a glass cover 401 may be located on a circuitboard 120 and the glass cover 401 may have a lateral surface, a topsurface and an open bottom surface.

At least one hole 402 may be formed in one of the surfaces to exhaustgas generated from heat of a light emitting device 104 or the circuitboard 120.

FIG. 5 is a diagram illustrating a glass cover according to anotherembodiment.

In reference to FIG. 5, a glass cover 401 may exhaust gas generated fromheat of a light emitting device 104 or a circuit board 120 outside viaat least one hole 402.

FIG. 6 is a diagram illustrating a glass cover according to a furtherembodiment.

In reference to FIG. 6, a glass cover 601 and 602 may include lateralsurfaces and a top surface. At least one of the lateral surfaces may beopen to exhaust gas generated by heat of a light emitting device 104 ora circuit board 120 outside.

According to an embodiment, a lateral surface of a glass cover 603 and605 may have two or more different heights.

For example, a lateral surface of the glass cover 603 may have twodifferent heights and a region having a larger height may be asupporting member 604 having a column shape.

For example, a lateral surface of the glass cover 604 may be a surfacehaving two different weights (h1 and h2).

FIG. 7 is a diagram illustrating a light emitting module according toanother embodiment.

In reference to FIG. 7, a glass cover 701 provided in the light emittingmodule according to this embodiment may be located on a circuit board120 and the glass cover 701 may include a reflection layer 702 formed ona predetermined surface of lateral surfaces.

The reflection layer 702 may reflect light generated from a lightemitting device 104 and it may include at least one of Al, Ag, Pt, Rh,Rd, Pd or Cr, for example. The reflection layer 702 including at leastone of them to reflect the light generated from the light emittingdevice 104 may be formed on at least predetermined surface of thelateral surfaces.

Also, the lateral surface of the glass cover 701 may include an inclinedsurface and the reflection layer 702 may be formed on the inclinedsurface.

The inclined surface of the glass cover 701 may be tilted toward thecircuit board 120 at approximately 10˜90 degrees.

As mentioned above, the reflection layer 701 may have a metal layerhaving a reflective material, for example, Al, Ag, Pt, Rh, Rd, Pd, Cr oran alloy of Al, Ag, Pt or Rh.

The reflection layer 701 formed on the inclined surface of the glasscover 701 may reflect the light generated from the light emitting device104 such that light extraction efficiency of the light emitting devicemay be improved advantageously.

FIG. 8 is a diagram illustrating a light emitting module according to afurther embodiment.

In reference to FIG. 8, a glass cover 801 provided in the light emittingmodule according to this embodiment may have a selective wavelengthconverting layer 802.

According to an embodiment, the selective wavelength converting layer802 may be a color filter and it may transmit light at a predeterminedwavelength out of the lights generated from the light emitting device104.

According to another embodiment, the selective wavelength convertinglayer 802 may be a phosphor layer and it may convert a light at a firstwavelength region into a light at a second wavelength region out of thelight generated from the light emitting device 104.

When the selective wavelength converting layer 802 is a phosphor,phosphor particles may convert a wavelength of the light generated fromthe light emitting device 104 into another wavelength to be an outputlight at a predetermined wavelength band. For example, when the lightemitting device 104 outputs a blue light, the selective wavelengthconverting layer 802 provided in the glass cover 801 may have a yellowphosphor and the output light may be a white light.

FIG. 9 is a diagram illustrating a light emitting module according to afurther embodiment.

In reference to FIG. 9, a resin layer 902 or a phosphor layer may befilled into a gap between a light emitting device and a glass cover 901in the light emitting device according to this embodiment. The resinlayer 902 may have a phosphor to convert a wavelength of the lightemitted from the light emitting device into another wavelength and aphosphor layer may be provided additionally. The resin layer may beformed of a silicon material or a synthetic material.

When phosphor particles are provided in the resin layer 902, phosphorparticles may convert the wavelength of the light generated from thelight emitting device 104 into another wavelength and a light at apredetermined wavelength band may be output. For example, when the lightemitting device 104 outputs a blue light, the resin layer 902 may have ayellow phosphor to output a white light.

In this instance, a distance between the light emitting device 104 andthe glass cover 901 may be 0.2˜40 mm.

FIG. 10 is a diagram illustrating a light emitting device according to astill further embodiment.

In reference to FIG. 10, the light emitting module according to thisembodiment may include a circuit board 120 having a metal substrate 101,an insulation layer 111 and a circuit pattern 112, at least one lightemitting device 104 disposed on the circuit board 120, with beingelectrically connected with the circuit board 120, a supporting part 106located on a predetermined region of the circuit board 120 where thecircuit pattern 112 is not formed, and a glass cover 107 supported bythe supporting part 160, with being spaced apart a predetermineddistance from a top surface of the light emitting device 104.

The circuit board 120 may have no cavity and a pad 110 may be located onthe circuit pattern 112 to be electrically connected with the lightemitting device 104 via a wire 105.

Alternatively, the glass cover 107 having lateral surfaces and a topsurface may be directly located on the circuit board 120, without thesupporting part 106.

FIG. 11 is a diagram illustrating a light emitting module according to astill further embodiment.

In reference to FIG. 11, the light emitting module according to thisembodiment may include a metal substrate 101, an insulation substrate102 located on the metal substrate 101, with a surface having aconductive pattern 103 located therein and at least one light emittingdevice 104 disposed on the insulation substrate 102. The light emittingdevice 104 may be electrically connected with the conductive pattern103.

A pad 110 may be located on an insulation layer 111 formed on the metalsubstrate 101 and the pad 110 may be electrically connected with thelight emitting device 104 via wire 105.

The metal substrate 101, the insulation layer 111 located on the metalsubstrate 101 and the circuit pattern (not shown) located on theinsulation layer 111 may form a circuit board 120.

A supporting part 106 may be disposed on a predetermined portion of thecircuit board 120 where the insulation substrate 102 is not located. Aglass cover 107 may be supported by the supporting part 106.

Alternatively, a glass cover 107 having lateral surfaces and a topsurface may be directly located on the circuit board 120, without thesupporting part 106.

The glass cover 107 may be spaced apart a predetermined distance fromthe top surface of the light emitting device 104.

FIG. 12 is a diagram illustrating a head lamp according to anembodiment, having a light emitting module applied thereto.

In reference to FIG. 12, light having transmitted a glass cover of alight emitting module 1001 provided in the head lamp according to thisembodiment may be reflected by a reflector 1002 and a shade 1003. Afterthat, the light may be travel forwardly, passing through a lens 1004.

The lens 1004 may refract the generated by the light emitting module1001 and the light reflected by the reflector 1002, to enable the lightsto travel forwardly.

As mentioned above, the light emitting module 1001 according to theembodiment may include the glass cover and it have the effect ofpreventing physical breakage of the wire and the light emitting deviceand of maintaining luminous efficiency of the light emitting device.

FIG. 13 is a diagram illustrating the effects of the light emittingmodule according to the embodiments.

In reference to FIG. 13, the light emitting module according to theembodiments may include the glass cover. Brightness of the light thattransmits the glass cover including only the glass material may beincreased, compared with brightness of the light that transmits theglass cover including the anti-reflective layer.

Also, brightness of the light that transmits the glass cover includingthe reflection layer formed on the supporting part or at leastpredetermined region of the glass cover (1102) may be increased,compared with brightness of the light that transmits the glass coverhaving only the anti-reflective layer (1103).

A plurality of light emitting devices may be mounted on the lightemitting device package provided in the light emitting module and theembodiment may not be limited thereto.

The plurality of the light emitting device packages according to theembodiment may be arrayed on a substrate. As optical members, a lightguide plate, a prism sheet and a diffusion sheet may be arranged on aluminous passage of the light emitting device packages. Those lightemitting device packages, the substrate and the optical members may befunctioned as a light unit. A further embodiment may be realized by adisplay device, a pointing device or a lighting system including thesemiconductor light emitting device or the light emitting device packageaccording to the embodiments. For example, the lighting system mayinclude a lamp and a streetlamp.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting module comprising: a lightemitting device package comprising a circuit board having a metalsubstrate; an insulation substrate having a conductive pattern disposedon the metal substrate, and at least one light emitting device disposedon the insulation substrate, and being electrically connected with theconductive pattern; a supporting part disposed on a predeterminedportion of the circuit board; a glass cover disposed on the lightemitting device package, with lateral surfaces and a top surface; a padelectrically connected with the light emitting device package via awire; and an insulation layer disposed on the metal substrate, the padbeing disposed on a top surface of the insulation layer, wherein thesupporting part includes a first portion and a second portion, a heightof the first portion being lower than a height of the second portion,wherein the first portion supports the glass cover, wherein a distancebetween the top surface of the glass cover and a bottom surface of thecircuit board is smaller than a distance between a top surface of thesecond portion and the bottom surface of the circuit board, and whereina distance between a top surface of the insulation substrate and thebottom surface of the circuit board is equal to a distance between thetop surface of the insulation layer and the bottom surface of thecircuit board.
 2. The light emitting module according to claim 1,wherein the supporting part is disposed on the metal substrate.
 3. Thelight emitting module according to claim 2, wherein the supporting partis disposed on a circumference region of the metal substrate.
 4. Thelight emitting module according to claim 1, wherein the glass cover isspaced apart a predetermined distance from a top surface of the lightemitting device.
 5. The light emitting module according to claim 1,wherein the glass cover comprises an anti-reflective coating layerdisposed on at least one surface thereof.
 6. The light emitting moduleaccording to claim 1, wherein the glass cover is disposed above thelight emitting device.
 7. The light emitting module according to claim1, wherein a distance between the light emitting device and the glasscover is within a range of 0.2˜40 mm.
 8. The light emitting moduleaccording to claim 1, wherein the supporting part comprises a reflectionlayer comprising at least one of Al, Ag, Pt, Rh, Rd, Pd or Cr.
 9. Thelight emitting module according to claim 1, wherein at least one surfaceof the glass cover comprises a light extraction pattern.
 10. The lightemitting module according to claim 1, wherein the light emitting devicecomprises: a light emitting structure comprising a first conductive typesemiconductor layer, an active layer and a second conductive typesemiconductor layer; a first electrode disposed on the first conductivetype semiconductor layer; and a second electrode disposed on the secondconductive type semiconductor layer.
 11. The light emitting moduleaccording to claim 1, wherein a height of the pad is higher than aheight of the conductive pattern.
 12. The light emitting moduleaccording to claim 1, wherein the insulation layer acts as an adhesivelayer to adhere the metal substrate to the pad and to adhere the metalsubstrate to the supporting part.
 13. The light emitting moduleaccording to claim 1, wherein the glass cover includes a selectivewavelength converting layer facing the light emitting device package totransmit light at a predetermined wavelength out of light generated fromthe light emitting device.
 14. The light emitting module according toclaim 1, further comprising a resin layer or a phosphor layer filledinto a gap between the light emitting device and the glass cover.
 15. Alight emitting module comprising: a light emitting device packagecomprising a circuit board having a metal substrate; an insulationsubstrate having a conductive pattern disposed on the metal substrate,and at least one light emitting device disposed on the insulationsubstrate, and being electrically connected with the conductive pattern;a glass cover disposed on the light emitting device package; a padelectrically connected with the light emitting device package via awire; and an insulation layer disposed on the metal substrate, the padbeing disposed on a top surface of the insulation layer, wherein atleast one groove is formed on a surface of the insulation substrate, andthe conductive pattern is disposed in the groove, wherein a distancebetween a top surface of the insulation substrate and a bottom surfaceof the circuit board is equal to a distance between a top surface of theconductive pattern and the bottom surface of the circuit board, andwherein the distance between the top surface of the insulation substrateand the bottom surface of the circuit board is equal to a distancebetween the top surface of the insulation layer and the bottom surfaceof the circuit board.
 16. The light emitting module according to claim15, wherein a height of the pad is higher than a height of theconductive pattern.
 17. The light emitting module according to claim 15,further comprising a supporting part disposed on a predetermined portionof the circuit board, wherein the supporting part includes a firstportion and a second portion, a height of the first portion being lowerthan a height of the second portion.
 18. The light emitting moduleaccording to claim 15, wherein a separation region is formed between theinsulation layer and the insulation substrate, and wherein a portion ofthe glass cover corresponds to the separated region.
 19. A head lampcomprising: a light emitting module configured to emit a light; areflector configured to reflect the light emitted from the lightemitting module; and a lens configured to refract the light emitted fromthe light emitting module and the light reflected by the reflector,wherein the light emitting module comprises: a light emitting devicepackage comprising a circuit board having a metal substrate; aninsulation substrate having a conductive pattern disposed on the metalsubstrate, and at least one light emitting device disposed on theinsulation substrate, and being electrically connected with theconductive pattern; an insulation layer disposed on the metal substrate;a supporting part disposed on a predetermined portion of the circuitboard; a glass cover disposed on the light emitting device package, withlateral surfaces and a top surface, wherein the supporting part includesa first portion and a second portion, a height of the first portionbeing lower than a height of the second portion, and wherein the firstportion supports the glass cover, wherein the metal substrate has aconstant thickness, and wherein a distance between a top surface of theinsulation substrate and a bottom surface of the circuit board is equalto a distance between a top surface of the insulation layer and thebottom surface of the circuit board.